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[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - The wetting interaction between electroless NiP deposit/Cu substrate and SnAg solder

✍ Scribed by Hsieh, Peishan; Lin, Kwang-Lung

Book ID: 120657403
Publisher: IEEE
Year: 2011
Weight: 732 KB
Category: Article
ISBN: 1457713888
DOI: 10.1109/IMPACT.2011.6117224

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