𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Thin glass substrates development and integration for through glass vias (TGV) with copper (Cu) interconnects

✍ Scribed by Bor Kai Wang, ; Yi-An Chen, ; Shorey, Aric; Piech, Garrett

Book ID: 121489855
Publisher: IEEE
Year: 2012
Tongue: English
Weight: 835 KB
Category: Article
ISBN: 1467316377
DOI: 10.1109/IMPACT.2012.6420306

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2012 7th International Microsystem

[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Green-lighting recyclable device of LED-MGVC

✍ Wang, Jung-Chang; Wen-Chou Chiang, ; Huang, Chun-Ling; Huang-Lin Wu, 📂 Article 📅 2012 🏛 IEEE 🌐 English ⚖ 905 KB

[IEEE 2012 7th International Microsystem

[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Experimental study on the performance of compact heat sink for LSI packages

✍ Hatakeyama, Tomoyuki; Ishizuka, Masaru; Kibushi, Risako 📂 Article 📅 2012 🏛 IEEE ⚖ 820 KB

[IEEE 2012 7th International Microsystem

[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Thermal analysis of plastic heat sink for high power LED lamp

✍ Huang, Leo; Chen, Eason; Lee, Daniel 📂 Article 📅 2012 🏛 IEEE ⚖ 964 KB

[IEEE 2011 6th International Microsystem

[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Advanced high density interconnection substrate for mobile platform application

✍ Romero, Christian; Park, Seungwook; Kweon, Youngdo; Park, Mijin 📂 Article 📅 2011 🏛 IEEE ⚖ 880 KB

[IEEE 2011 6th International Microsystem

[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - The wetting interaction between electroless NiP deposit/Cu substrate and SnAg solder

✍ Hsieh, Peishan; Lin, Kwang-Lung 📂 Article 📅 2011 🏛 IEEE ⚖ 732 KB

[IEEE 2011 6th International Microsystem

[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Nonlinear thermal stress analyses and design guidelines for through silicon vias (TSVs) in 3D IC integration

✍ Hsieh, Ming-Che; Wu, Sheng-Tsai; Li, Wei; Tain, Ra-Min; Lau, John H.; Lo, Robert 📂 Article 📅 2011 🏛 IEEE ⚖ 955 KB