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[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Thermal analysis of plastic heat sink for high power LED lamp

✍ Scribed by Huang, Leo; Chen, Eason; Lee, Daniel

Book ID: 120061117
Publisher: IEEE
Year: 2012
Weight: 964 KB
Category: Article
ISBN: 1467316377
DOI: 10.1109/IMPACT.2012.6420272

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