𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Analytical time-dependent model for satellite thermal balance

✍ Scribed by Ramirez, Leopoldo; Wang, Jun; Quojing, Liu

Book ID: 121803965
Publisher: IEEE
Year: 2010
Weight: 1001 KB
Category: Article
ISBN: 1424497833
DOI: 10.1109/IMPACT.2010.5699466

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2010 5th International Microsystem

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Coin insertion technology for PCB thermal solution

✍ Lee, Chien-Cheng; Chen, Wu-Yung 📂 Article 📅 2010 🏛 IEEE ⚖ 282 KB

[IEEE 2010 5th International Microsystem

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Thermo-mechanical analysis of thermoelectric modules

✍ Li, Sheng-Liang; Liu, Chun-Kai; Hsu, Chung-Yen; Hsieh, Ming-Che; Dai, Ming-Ji; W 📂 Article 📅 2010 🏛 IEEE ⚖ 366 KB

[IEEE 2010 5th International Microsystem

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Dynamic electrical resistance effects in resistance spot welding

✍ Wu, T. H.; Ho, J. E.; Wei, P. S. 📂 Article 📅 2010 🏛 IEEE ⚖ 134 KB

[IEEE 2010 5th International Microsystem

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Flexible printed circuit board (FPC) antennas for mobile phone operation

✍ Wu, Kuo-Liang; Sun, Jwo-Shiun; Chen, Guan-Yu 📂 Article 📅 2010 🏛 IEEE ⚖ 104 KB

[IEEE 2010 5th International Microsystem

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Analysis of bump resistance and electrical distribution of ultra-fine-pitch microbumps

✍ Chang, Y. W.; Peng, H. Y.; Yang, R. W.; Chen, Chih; Chang, T. C.; Zhan, C. J.; J 📂 Article 📅 2010 🏛 IEEE ⚖ 265 KB

[IEEE 2010 5th International Microsystem

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Fast and power efficient 16×16 Array of Array multiplier using Vedic Multiplication

✍ Gurumurthy, K. S.; Prahalad, M. S 📂 Article 📅 2010 🏛 IEEE ⚖ 167 KB