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[IEEE 2008 IEEE International Conference on Microelectronic Test Structure (ICMTS) - Edinburgh, UK (2008.03.24-2008.03.27)] 2008 IEEE International Conference on Microelectronic Test Structures - Test structures for the evaluation of 3D chip interconnection schemes

✍ Scribed by Mathewson, A.; Brun, J.; Franiatte, R.; Nowodzinski, A.; Ancient, R.; Sillon, N.; Depoutot, F.; Dubois-Bonvalot, B.

Book ID: 126743247
Publisher: IEEE
Year: 2008
Weight: 938 KB
Category: Article
ISBN: 1424418011
DOI: 10.1109/ICMTS.2008.4509325

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