## Abstract Germanium doping of Czochralski (CZ) silicon has attracted attention in recent years. It is pointed out that germanium doping can result in denser voids with small size, which can be eliminated easily by annealing at high temperature, and may improve the gate oxide integrity (GOI) of se
Germanium effect on oxygen-related defects in Czochralski silicon
β Scribed by Yang, Deren ;Chen, Jiahe ;Li, Hong ;Ma, Xiangyang ;Tian, Daxi ;Li, Liben ;Que, Duanlin
- Publisher
- John Wiley and Sons
- Year
- 2006
- Tongue
- English
- Weight
- 249 KB
- Volume
- 203
- Category
- Article
- ISSN
- 0031-8965
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β¦ Synopsis
Abstract
The behaviours of germanium doped in Czochralski (CZ) silicon have attracted considerable attention in recent years. In this article, a review concerning recent processes in the study about oxygen related defects in germaniumβdoped CZ (GCZ) silicon is presented. The formation of oxygen precipitates during CZ silicon growth can be improved by germanium, and the oxygen precipitation during thermal cycles can be enhanced, so that the internal gettering (IG) ability of GCZ silicon wafers for metallic impurities is improved. Meanwhile, the morphology of oxygen precipitates can be changed in GCZ silicon. Thermal donors (TDs) can be suppressed by germanium doping as the result of the reaction between germanium and point defects, while new donors (NDs) can be strongly enhanced in GCZ silicon because of a process associated with the nucleation enhancement of oxygen precipitates with germanium doping. (Β© 2006 WILEYβVCH Verlag GmbH & Co. KGaA, Weinheim)
π SIMILAR VOLUMES
Spectroscopic investigations during the last decade have resulted in a detailed picture of oxygen related defects in germanium such as oxygen interstitials and thermal donors. The results are summarized and compared with those of equivalent centres in silicon. The many similarities suggest that unif