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Future trends of cross-sectional transmission electron microscopy for electronic and photonic devices

✍ Scribed by T.T. Sheng

Publisher: Elsevier Science
Year: 1987
Tongue: English
Weight: 574 KB
Volume: 154
Category: Article
ISSN: 0040-6090
DOI: 10.1016/0040-6090(87)90353-1

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## Abstract A method is described for the preparation of cross‐sectional samples of thin films for transmission electron microscopy. The technique produces larger amounts of thin region as compared with ion milling and eliminates the problems associated with ion beam damage. The requirement is that