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Evaluation of strain sources in bond and etchback silicon-on-insulator

✍ Scribed by R. Egloff; T. Letavic; B. Greenberg; H. Baumgart

Publisher: Elsevier Science
Year: 1995
Tongue: English
Weight: 890 KB
Volume: 49
Category: Article
ISSN: 0165-5817
DOI: 10.1016/0165-5817(95)82006-x

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