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Effect of wafer size on material removal rate and its distribution in chemical mechanical polishing of silicon dioxide film

✍ Scribed by Lee, Hyunseop; Park, Yeongbong; Lee, Sangjik; Jeong, Haedo

Book ID: 121615373
Publisher: Springer-Verlag
Year: 2013
Tongue: English
Weight: 611 KB
Volume: 27
Category: Article
ISSN: 1738-494X
DOI: 10.1007/s12206-013-0802-7

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