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Chemical effect on the material removal rate in the CMP of silicon wafers

✍ Scribed by Y.G. Wang; L.C. Zhang; A. Biddut

Publisher
Elsevier Science
Year
2011
Tongue
English
Weight
399 KB
Volume
270
Category
Article
ISSN
0043-1648

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In this paper, the cleaning of silicon after CMP (chemical mechanical polishing) in ULSI was studied utilizing preferential adsorption knowledge. On the basis of analyzing adsorption state of contaminated particles on polished silicon wafer and interrelated adsorption theory, the preferential adsorp