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Effect of Process Parameters on Material Removal Rate in Chemical Mechanical Polishing of 6H-SiC(0001)

✍ Scribed by An, Joon Ho; Lee, Gi Sub; Lee, Won Jae; Shin, Byoung Chul; Seo, Jung Doo; Ku, Kap Ryeol; Seo, Heon Decok; Jeong, Hae Do

Book ID: 120658858
Publisher: Trans Tech Publications, Ltd.
Year: 2008
Tongue: English
Weight: 605 KB
Volume: 600-603
Category: Article
ISSN: 1662-9752
DOI: 10.4028/www.scientific.net/MSF.600-603.831

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