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Effect of mechanical process parameters on friction behavior and material removal during sapphire chemical mechanical polishing

✍ Scribed by Zefang Zhang; Weixia Yan; Lei Zhang; Weili Liu; Zhitang Song

Book ID: 113797827
Publisher: Elsevier Science
Year: 2011
Tongue: English
Weight: 399 KB
Volume: 88
Category: Article
ISSN: 0167-9317
DOI: 10.1016/j.mee.2011.04.068

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