𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Mechanical effect of process condition and abrasive concentration on material removal rate profile in copper chemical mechanical planarization

✍ Scribed by Hyunseop Lee; Boumyoung Park; Haedo Jeong

Book ID
108178940
Publisher
Elsevier Science
Year
2009
Tongue
English
Weight
978 KB
Volume
209
Category
Article
ISSN
0924-0136

No coin nor oath required. For personal study only.

πŸ“œ SIMILAR VOLUMES

Pad Surface Roughness and Slurry Particl
Pad Surface Roughness and Slurry Particle Size Distribution Effects on Material Removal Rate in Chemical Mechanical Planarization
✍ C. Wang; P. Sherman; A. Chandra; D. Dornfeld πŸ“‚ Article πŸ“… 2005 πŸ› International Academy for Production Engineering 🌐 English βš– 677 KB

The ability to predict material removal rates in chemical mechanical planarization (CMP) is an essential ingredient for low cost, high quality IC chips. Recently, models that address the slurry particles have been proposed. We address three such models. The first two differ only in how the number of