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Pad effects on material-removal rate in chemical-mechanical planarization

✍ Scribed by Ashraf Bastawros; Abhijit Chandra; Yongjin Guo; Bo Yan


Book ID
107452737
Publisher
Springer US
Year
2002
Tongue
English
Weight
1021 KB
Volume
31
Category
Article
ISSN
0361-5235

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The ability to predict material removal rates in chemical mechanical planarization (CMP) is an essential ingredient for low cost, high quality IC chips. Recently, models that address the slurry particles have been proposed. We address three such models. The first two differ only in how the number of