A model for wafer scale variation of material removal rate in chemical mechanical polishing based on viscoelastic pad deformation

✍ Scribed by Guanghui Fu; Abhijit Chandra

• Book ID: 107452743
• Publisher: Springer US
• Year: 2002
• Tongue: English
• Weight: 616 KB
• Volume: 31
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-002-0044-4