A model for wafer scale variation of removal rate in chemical mechanical polishing based on elastic pad deformation

✍ Scribed by Guanghui Fu; Abhijit Chandra

• Book ID: 107452618
• Publisher: Springer US
• Year: 2001
• Tongue: English
• Weight: 169 KB
• Volume: 30
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-001-0051-x