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Influence of Colloidal Abrasive Size on Material Removal Rate and Surface Finish in SiO 2 Chemical Mechanical Polishing

✍ Scribed by Zhou, Chunhong; Shan, Lei; Hight, J. Robert; Danyluk, Steven; Ng, S. H.; Paszkowski, Andrew J.

Book ID: 121322963
Publisher: Taylor and Francis Group
Year: 2002
Tongue: English
Weight: 636 KB
Volume: 45
Category: Article
ISSN: 1040-2004
DOI: 10.1080/10402000208982545

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