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Dry via hole etching of GaAs using high-density Cl[sub 2]/Ar plasma

✍ Scribed by Chen, Y. W.; Ooi, B. S.; Ng, G. I.; Radhakrishnan, K.; Tan, C. L.


Book ID
121308011
Publisher
AVS (American Vacuum Society)
Year
2000
Tongue
English
Weight
610 KB
Volume
18
Category
Article
ISSN
0734-211X

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