✦ LIBER ✦

Wettability of electroplated Ni-P in under bump metallurgy with Sn-Ag-Cu solder

✍ Scribed by Yung-Chi Lin; Jenq-Gong Duh; Bi-Shiou Chiou

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Compound formation for electroplated Ni

✍ Bi-Lian Young; Jenq-Gong Duh; Guh-Yaw Jang 📂 Article 📅 2003 🏛 Springer US 🌐 English ⚖ 406 KB

The Crystal Orientation of β-Sn Grains i

✍ Sun-Kyoung Seo; Sung K. Kang; Moon Gi Cho; Da-Yuan Shih; Hyuck Mo Lee 📂 Article 📅 2009 🏛 Springer US 🌐 English ⚖ 796 KB

Electrical characteristics for Sn-Ag-Cu

✍ T. I. Shih; Y. C. Lin; J. G. Duh; Tom Hsu 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 485 KB

Optimal phosphorous content selection fo

✍ Yung-Chi Lin; Jenq-Gong Duh 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 262 KB

The effect of intermetallic compound mor

✍ Guh-Yaw Jang; Jenq-Gong Duh 📂 Article 📅 2005 🏛 Springer US 🌐 English ⚖ 595 KB

Liquid–solid interfacial reactions of Sn

✍ Dong-Liang Wang; Yuan Yuan; Le Luo 📂 Article 📅 2011 🏛 Springer US 🌐 English ⚖ 731 KB