✦ LIBER ✦

The effect of intermetallic compound morphology on Cu diffusion in Sn-Ag and Sn-Pb solder bump on the Ni/Cu Under-bump metallization

✍ Scribed by Guh-Yaw Jang; Jenq-Gong Duh

No coin nor oath required. For personal study only.

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Interfacial reactions and compound forma

✍ Chien-Sheng Huang; Guh-Yaw Jang; Jeng-Gong Duh 📂 Article 📅 2003 🏛 Springer US 🌐 English ⚖ 800 KB