✦ LIBER ✦

Optimal phosphorous content selection for the soldering reaction of Ni-P under bump metallization with Sn-Ag-Cu solder

✍ Scribed by Yung-Chi Lin; Jenq-Gong Duh

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Wettability of electroplated Ni-P in und

✍ Yung-Chi Lin; Jenq-Gong Duh; Bi-Shiou Chiou 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 336 KB

Electrical characteristics for Sn-Ag-Cu

✍ T. I. Shih; Y. C. Lin; J. G. Duh; Tom Hsu 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 485 KB

Liquid–solid interfacial reactions of Sn

✍ Dong-Liang Wang; Yuan Yuan; Le Luo 📂 Article 📅 2011 🏛 Springer US 🌐 English ⚖ 731 KB

Metallurgical reaction of the Sn-3.5Ag s

✍ Chien-Sheng Huang; Jenq-Gong Duh; Yen-Ming Chen 📂 Article 📅 2003 🏛 Springer US 🌐 English ⚖ 152 KB

Interfacial reactions and compound forma

✍ Szu-Tsung Kao; Jenq-Gong Duh 📂 Article 📅 2005 🏛 Springer US 🌐 English ⚖ 684 KB

The effect of intermetallic compound mor

✍ Guh-Yaw Jang; Jenq-Gong Duh 📂 Article 📅 2005 🏛 Springer US 🌐 English ⚖ 595 KB