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Liquid–solid interfacial reactions of Sn–Ag and Sn–Ag–In solders with Cu under bump metallization

✍ Scribed by Dong-Liang Wang; Yuan Yuan; Le Luo

Publisher
Springer US
Year
2011
Tongue
English
Weight
731 KB
Volume
23
Category
Article
ISSN
0957-4522

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It had been reported that, during the reflow of the Sn-Ag-Cu solders over the Ni-bearing surface finishes, a slight variation in Cu concentration produced different reaction products at the interface. In this study, we extended our earlier efforts to investigate whether this strong Cu concentration