✦ LIBER ✦
Correlation between interfacial microstructure and shear behavior of Sn–Ag–Cu solder ball joined with Sn–Zn–Bi paste
✍ Scribed by Po-Cheng Shih; Kwang-Lung Lin
- Publisher
- Springer
- Year
- 2007
- Tongue
- English
- Weight
- 949 KB
- Volume
- 42
- Category
- Article
- ISSN
- 0022-2461
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