Interfacial reactions between Sn–57Bi–1Ag solder and electroless Ni-P/immersion Au under solid-state aging

✍ Scribed by Christopher Fuchs; Timo Schreck; Michael Kaloudis

• Publisher: Springer
• Year: 2012
• Tongue: English
• Weight: 527 KB
• Volume: 47
• Category: Article
• ISSN: 0022-2461
• DOI: 10.1007/s10853-012-6257-x