TEM study on the interfacial reaction between electroless plated Ni−P/Au UBM and Sn−3.5Ag solder

✍ Scribed by Min-Ho Park; Eun-Jung Kwon; Han-Byul Kang; Seung-Boo Jung; Cheol-Woong Yang

• Publisher: TechnoPress
• Year: 2007
• Tongue: English
• Weight: 687 KB
• Volume: 13
• Category: Article
• ISSN: 1598-9623
• DOI: 10.1007/bf03027811