Influence of solid-state interfacial reactions on the tensile strength of Cu/electroless Ni–P/Sn–3.5Ag solder joint

✍ Scribed by Aditya Kumar; Zhong Chen

• Publisher: Elsevier Science
• Year: 2006
• Tongue: English
• Weight: 687 KB
• Volume: 423
• Category: Article
• ISSN: 0921-5093
• DOI: 10.1016/j.msea.2005.12.040