Compound formation for electroplated Ni and electroless Ni in the under-bump metallurgy with Sn-58Bi solder during aging

✍ Scribed by Bi-Lian Young; Jenq-Gong Duh; Guh-Yaw Jang

• Publisher: Springer US
• Year: 2003
• Tongue: English
• Weight: 406 KB
• Volume: 32
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-003-0116-0