✦ LIBER ✦

Interfacial reaction between 42Sn-58Bi solder and electroless Ni-P/immersion Au under bump metallurgy during aging

✍ Scribed by Moon Gi Cho; Kyung Wook Paik; Hyuck Mo Lee; Seong Woon Booh; Tae-Gyu Kim

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Interfacial reactions between Sn–57Bi–1A

✍ Christopher Fuchs; Timo Schreck; Michael Kaloudis 📂 Article 📅 2012 🏛 Springer 🌐 English ⚖ 527 KB

Compound formation for electroplated Ni

✍ Bi-Lian Young; Jenq-Gong Duh; Guh-Yaw Jang 📂 Article 📅 2003 🏛 Springer US 🌐 English ⚖ 406 KB

Characterization of Interfacial Reaction

✍ Han-Byul Kang; Jee-Hwan Bae; Jae-Wook Lee; Min-Ho Park; Jeong-Won Yoon; Seung-Bo 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 373 KB

Interfacial reactions and compound forma

✍ Szu-Tsung Kao; Jenq-Gong Duh 📂 Article 📅 2005 🏛 Springer US 🌐 English ⚖ 684 KB

TEM study on the interfacial reaction be

✍ Min-Ho Park; Eun-Jung Kwon; Han-Byul Kang; Seung-Boo Jung; Cheol-Woong Yang 📂 Article 📅 2007 🏛 TechnoPress 🌐 English ⚖ 687 KB

The Crystal Orientation of β-Sn Grains i

✍ Sun-Kyoung Seo; Sung K. Kang; Moon Gi Cho; Da-Yuan Shih; Hyuck Mo Lee 📂 Article 📅 2009 🏛 Springer US 🌐 English ⚖ 796 KB