The Crystal Orientation of β-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy

✍ Scribed by Sun-Kyoung Seo; Sung K. Kang; Moon Gi Cho; Da-Yuan Shih; Hyuck Mo Lee

• Publisher: Springer US
• Year: 2009
• Tongue: English
• Weight: 796 KB
• Volume: 38
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-009-0902-4