✦ LIBER ✦

elemental redistribution and interfacial reaction mechanism for the flip chip Sn-3.0Ag-(0.5 or 1.5)Cu solder bump with Al/Ni(V)/Cu under-Bump metallization during aging

✍ Scribed by Guh-Yaw Jang; Jenq-Gong Duh

No coin nor oath required. For personal study only.

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