Characterizing metallurgical reaction of Sn3.0Ag0.5Cu composite solder by mechanical alloying with electroless Ni-P/Cu under-bump metallization after various reflow cycles

✍ Scribed by Li-Yin Hsiao; Szu-Tsung Kao; Jenq-Gong Duh

• Publisher: Springer US
• Year: 2006
• Tongue: English
• Weight: 419 KB
• Volume: 35
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-006-0188-8