Reaction Mechanism and Mechanical Properties of the Flip-Chip Sn-3.0Ag-0.5Cu Solder Bump with Cu/Ni-xCu/Ti Underbump Metallization After Various Reflows

✍ Scribed by Chung-Nan Peng; Jenq-Gong Duh

• Publisher: Springer US
• Year: 2009
• Tongue: English
• Weight: 858 KB
• Volume: 38
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-009-0943-8