Influence of Cu content on compound formation near the chip side for the flip-chip Sn-3.0Ag-(0.5 or 1.5)Cu solder bump during aging

✍ Scribed by Guh-Yaw Jang; Jeng-Gong Duh; Hideyuki Takahashi; Szu-Wei Lu; Jen-Chuan Chen

• Publisher: Springer US
• Year: 2006
• Tongue: English
• Weight: 492 KB
• Volume: 35
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-006-0229-3