๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Wafer cost analysis for a Soft X-Ray Projection Lithography system

โœ Scribed by N.M. Ceglio; A.M. Hawryluk


Book ID
113387908
Publisher
IOS Press
Year
1992
Tongue
English
Weight
811 KB
Volume
3
Category
Article
ISSN
0895-3996

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A high-throughput SCALPEL tool will employ a typical exposure current of 30 pA and electron column potential of 100 KV, delivering power up to -3 W through a 0.25 mm (wafer scale) square optical subfield. Electrons lose energy to form heat in the upper 60 gm of a wafer in vacuum during a sub-field e