𝔖 Bobbio Scriptorium

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Ultra-reliable packaging for silicon-on-silicon WSI: J K HAGGE (Rockwell Int. Corp., Cedar Rapids, IA, USA) 1988 Proceedings of the 38th Electronics Components Conference (88CH2600-5), Los Angeles, CA, USA, 9–11 May 1988 (New York, NY, USA: IEEE 1988), pp. 282–292

Book ID: 107829229
Publisher: Elsevier Science
Year: 1989
Tongue: English
Weight: 97 KB
Volume: 20
Category: Article
ISSN: 0026-2692
DOI: 10.1016/0026-2692(89)90028-1

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