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Multilayer thin-film substrate for multichip packaging: C C CHAO, K D SCHOLZ, J LEIBOVITZ, M L COBARRUVIAZ, C C CHANG (Hewlett- Packard Co., Palo Alto, CA, USA) 1988 Proceedings of the 38th Electronics Components Conference (88CH2600-5), Los Angeles, CA, USA, 9–11 May 1988 (New York, NY, USA: IEEE 1988), pp. 276–281

Book ID: 107829228
Publisher: Elsevier Science
Year: 1989
Tongue: English
Weight: 97 KB
Volume: 20
Category: Article
ISSN: 0026-2692
DOI: 10.1016/0026-2692(89)90027-x

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