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New film-type die attach adhesives: T L HOOPMAN, R S REYLEK, J L SCHENZ, K C THOMPSON (3M Center, St. Paul, MN, USA) 1988 Proceedings of the 38th Electronics Components Conference (88CH2600-5), Los Angeles, CA, USA, 9–11 May 1988 (New York, NY, USA: IEEE 1988), pp. 473–479

Publisher: Elsevier Science
Year: 1989
Tongue: English
Weight: 104 KB
Volume: 20
Category: Article
ISSN: 0026-2692
DOI: 10.1016/0026-2692(89)90016-5

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