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Thermal management of a high-performance multichip module : C C CHEN, P L YOUNG, J M CECH (Boeing Electron. Co., Seattle, WA, USA) 1988 Proceedings of the 38th Electronics Components Conference (88CH2600-5), Los Angeles, CA, USA, 9–11 May 1988 (New York, NY, USA: IEEE 1988). pp. 302–304

Publisher: Elsevier Science
Year: 1989
Tongue: English
Weight: 76 KB
Volume: 20
Category: Article
ISSN: 0026-2692
DOI: 10.1016/0026-2692(89)90078-5

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