𝔖 Bobbio Scriptorium

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The development of new copper ball bonding-wire: S MORI (Mitsubishi Metal Co. Ltd., Saitama, Japan), H YOSHIDA, N UCHIYAMA 1988 Proceedings of the 38th Electronics Components Conference (88CH260-5), Los Angeles, CA, USA, 9–11 May 1988 (New York, NY, USA: IEEE 1988), pp. 539–545

Publisher: Elsevier Science
Year: 1989
Tongue: English
Weight: 99 KB
Volume: 20
Category: Article
ISSN: 0026-2692
DOI: 10.1016/0026-2692(89)90018-9

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