New systems for fabrication of wafer scale interconnections in multichip packages : J F McDONALD, H T LIN, N MAJID, H GREUB, R PHILHOWER, S DABRAL (Center for Integrated Electron., Rensselaer Polytech. Inst., Troy, NJ, USA) 1988 Proceedings of the 38th Electronics Components Conference (88CH2600-5), Los Angeles, CA, USA, 9–11 May 1988 (New York, NY, USA: IEEE 1988), pp. 305–314