𝔖 Bobbio Scriptorium

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High reliability silver paste for die bonding: Y OKABE, A KUSUHARA, M MIZUNO, K HORIUCHI (Sumitomo Bakelite Co. Ltd., Kanagawa, Japan) 1988 Proceedings of the 38th Electronics Components Conference (88CH2600-5), Los Angeles, CA, USA, 9–11 mAY 1988 (New York, NY, USA: IEEE 1988), pp. 468–472

Book ID: 107829223
Publisher: Elsevier Science
Year: 1989
Tongue: English
Weight: 104 KB
Volume: 20
Category: Article
ISSN: 0026-2692
DOI: 10.1016/0026-2692(89)90015-3

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