Internal thermal resistance of a multi-chip packaging design for VLSI-based systems : Y C LEE, H T GHAFFARI, J M SEGELKEN (AT&T Bell Lab., Murray Hill, NJ, USA) 1988 Proceedings of the 38th Electronics Components Conference (88CH2600-5), Los Angeles, CA, USA, 9–11 May 1988 (New York, NY, USA: IEEE 1988), pp. 293–301

• Book ID: 107829249
• Publisher: Elsevier Science
• Year: 1989
• Tongue: English
• Weight: 76 KB
• Volume: 20
• Category: Article
• ISSN: 0026-2692
• DOI: 10.1016/0026-2692(89)90077-3