𝔖 Bobbio Scriptorium

✦ LIBER ✦

Impact of residue on Al/Si pads on gold bonding: S S AHMAD (Intel Corp., Chandler, AZ, USA) 1988 Proceedings of the 38th Electronics Components Conference (88CH2600-5), Los Angeles, CA, USA, 9–11 May 1988 (New York, NY, USA: IEEE 1988), pp. 534–538

Book ID: 107829224
Publisher: Elsevier Science
Year: 1989
Tongue: English
Weight: 104 KB
Volume: 20
Category: Article
ISSN: 0026-2692
DOI: 10.1016/0026-2692(89)90017-7

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Thermosonic gold-wire bonding to preciou

Thermosonic gold-wire bonding to precious-metal-free copper lead-frames: B LANG, S PINAMANENI (Nat. Semicond. Corp., Santa Clara, CA, USA) 1988 Proceedings of the 38th Electronics Components Conference (88CH2600-5), Los Angeles, CA, USA, 9–11 May 1988 (New York, NY, USA: IEEE 1988), pp. 546–551

📂 Article 📅 1989 🏛 Elsevier Science 🌐 English ⚖ 99 KB

Ultra-reliable packaging for silicon-on-

Ultra-reliable packaging for silicon-on-silicon WSI: J K HAGGE (Rockwell Int. Corp., Cedar Rapids, IA, USA) 1988 Proceedings of the 38th Electronics Components Conference (88CH2600-5), Los Angeles, CA, USA, 9–11 May 1988 (New York, NY, USA: IEEE 1988), pp. 282–292

📂 Article 📅 1989 🏛 Elsevier Science 🌐 English ⚖ 97 KB

A new organic hybrid circuit based on an

A new organic hybrid circuit based on an aramid/epoxy laminate : E TSUNASHIMA (Matsushita Electron. Corp., Kyoto, Japan), T HIRAKAWA, K NISHIMURA, A OKUNO 1988 Proceedings of the 38th Electronics Components Conference (88CH2600-5), Los Angeles, CA, USA, 9–11 May 1988 (New York, NY, USA: IEEE 1988), pp. 480–485

📂 Article 📅 1989 🏛 Elsevier Science 🌐 English ⚖ 100 KB

Thermal management of a high-performance

Thermal management of a high-performance multichip module : C C CHEN, P L YOUNG, J M CECH (Boeing Electron. Co., Seattle, WA, USA) 1988 Proceedings of the 38th Electronics Components Conference (88CH2600-5), Los Angeles, CA, USA, 9–11 May 1988 (New York, NY, USA: IEEE 1988). pp. 302–304

📂 Article 📅 1989 🏛 Elsevier Science 🌐 English ⚖ 76 KB

High reliability silver paste for die bo

High reliability silver paste for die bonding: Y OKABE, A KUSUHARA, M MIZUNO, K HORIUCHI (Sumitomo Bakelite Co. Ltd., Kanagawa, Japan) 1988 Proceedings of the 38th Electronics Components Conference (88CH2600-5), Los Angeles, CA, USA, 9–11 mAY 1988 (New York, NY, USA: IEEE 1988), pp. 468–472

📂 Article 📅 1989 🏛 Elsevier Science 🌐 English ⚖ 104 KB

New film-type die attach adhesives: T L

New film-type die attach adhesives: T L HOOPMAN, R S REYLEK, J L SCHENZ, K C THOMPSON (3M Center, St. Paul, MN, USA) 1988 Proceedings of the 38th Electronics Components Conference (88CH2600-5), Los Angeles, CA, USA, 9–11 May 1988 (New York, NY, USA: IEEE 1988), pp. 473–479

📂 Article 📅 1989 🏛 Elsevier Science 🌐 English ⚖ 104 KB