𝔖 Bobbio Scriptorium

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Thermosonic gold-wire bonding to precious-metal-free copper lead-frames: B LANG, S PINAMANENI (Nat. Semicond. Corp., Santa Clara, CA, USA) 1988 Proceedings of the 38th Electronics Components Conference (88CH2600-5), Los Angeles, CA, USA, 9–11 May 1988 (New York, NY, USA: IEEE 1988), pp. 546–551

Book ID: 107829225
Publisher: Elsevier Science
Year: 1989
Tongue: English
Weight: 99 KB
Volume: 20
Category: Article
ISSN: 0026-2692
DOI: 10.1016/0026-2692(89)90019-0

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