𝔖 Bobbio Scriptorium

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Transient thermal gradients across solder interconnections in electronic systems

✍ Scribed by Sherif, R.A.; Schwartz, H.B.; Brewster, R.A.

Book ID: 114560365
Publisher: IEEE
Year: 1992
Tongue: English
Weight: 510 KB
Volume: 15
Category: Article
ISSN: 0148-6411
DOI: 10.1109/33.180031

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