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[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Mean time to failure of SnAgCuNi solder joints under DC

✍ Scribed by Basaran, Cemal; Li, Shidong; Hopkins, Douglas C.; Yao, Wei

Book ID: 126653894
Publisher: IEEE
Year: 2012
Weight: 523 KB
Category: Article
ISBN: 1424495318
DOI: 10.1109/ITHERM.2012.6231474

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