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[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Solder-bonded carbon nanotube thermal interface materials

✍ Scribed by Barako, Michael T.; Gao, Yuan; Marconnet, Amy M.; Asheghi, Mehdi; Goodson, Kenneth E.

Book ID: 125494460
Publisher: IEEE
Year: 2012
Weight: 900 KB
Category: Article
ISBN: 1424495318
DOI: 10.1109/ITHERM.2012.6231562

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