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[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Skin effect and material degradation of lead-free solder joint under AC

โœ Scribed by Yao Wei, ; Cemal, Basaran


Book ID
126748266
Publisher
IEEE
Year
2012
Weight
753 KB
Category
Article
ISBN
1424495318

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