Transient thermal gradients across solder interconnections in electronic systems : Raed A. Sherif, Howell B. Schwartz and Robert A. Brewster. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15 (5), 685 (1992)

• Book ID: 103284657
• Publisher: Elsevier Science
• Year: 1993
• Tongue: English
• Weight: 113 KB
• Volume: 33
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(93)90370-e