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[IEEE InterSociety Conference on Thermal Phenomena in Electronic Systems - Las Vegas, NV, USA (23-25 May 1990)] InterSociety Conference on Thermal Phenomena in Electronic Systems - Transient thermal strain measurements in electronic packages

✍ Scribed by Bastawros, A.F.; Voloshin, A.S.

Book ID: 126639800
Publisher: IEEE
Year: 1990
Weight: 821 KB
Category: Article
DOI: 10.1109/ITHERM.1990.113312

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